The proper management of heat within a device, component, process, building or vehicle can make the difference between the successful implementation of a design and an expensive redesign and adjustment. Many problems can be avoided by mapping heat flows, temperature distributions and effects of temperature differences and variations on a part at an early design stage. We can perform such in-depth thermal analyses to uncover relevant details in a part’s design, as well as evaluate large and complex designs at the system level. From a multiphysics perspective, we are able to combine thermal analyses with analyses in other physical domains, such as electromagnetics for calculating heat development in coils, structural mechanics for thermal stress evaluation, and fluid-flow applications to observe heat transport by (natural) convection or buoyancy effects.