The proper management of heat within a device, component, process, building or vehicle can make the difference between the successful implementation of a design and an expensive redesign and adjustment. Many problems can be avoided by mapping heat flows, temperature distributions and effects of temperature differences and variations on a part at an early design stage. We can perform such in-depth thermal analyses to uncover relevant details in a part’s design, as well as evaluate large and complex designs at the system level. From a multiphysics perspective, we are able to combine thermal analyses with analyses in other physical domains, such as electromagnetics for calculating heat development in coils, structural mechanics for thermal stress evaluation, and fluid-flow applications to observe heat transport by (natural) convection or buoyancy effects.
Applications that we work on
- Heat exchangers
- Heating, ventilation and air-conditioning
- Thermomechanical stress build-up
- Radiation effects
- Convective and conductive thermal processes
- Cooling of electronics
- Conjugate heat transfer
- Combustion processes
- Evaporation and condensation
heat exchangers and heat-transfer systems.
The proper and efficient transfer of heat can have a highly positive effect on process efficiency. Integrating heat exchangers in industrial processes, however, represents a significant investment. Therefore, the application of heat exchangers or other heat-transfer mechanisms requires a critical evaluation of their design and geometry. We can make significant contributions to the design, improvement and optimization of heat exchangers and other heat-transfer systems.